Product Overview

KJ-940 High-Temperature Putty Adhesive is specifically developed for high-temperature infusion molding in industries such as aerospace and other composite material manufacturing. Made through advanced processes, it is suitable for high-temperature applications. Upon heating, the product becomes sticky and cures through vulcanization, capable of operating at temperatures up to 400°C, with a short-term maximum temperature resistance of up to 426°C. Additionally, it has excellent sealing properties during the curing cycle, and after curing, it can be easily removed from the mold surface without leaving any residue.

Applicable Scope

Applied in the aerospace industry and other composite material industries for high-temperature infusion molding processes.